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| CR05AS-8 Thyristor Low Power Use REJ03G0543-0100 Rev.1.00 Mar.01.2005 Features * IT (AV) : 0.5 A * VDRM : 400 V * IGT : 100 A * Non-Insulated Type * Planar Passivation Type Outline PLZZ0004CA-A (Package name: UPAK) 1 2 3 2, 4 4 3 1 1. 2. 3. 4. Cathode Anode Gate Anode Applications Solid state relay, strobe flasher, igniter, and hybrid IC Maximum Ratings Parameter Repetitive peak reverse voltage Non-repetitive peak reverse voltage DC reverse voltage Repetitive peak off-state voltageNote1 DC off-state voltageNote1 Symbol VRRM VRSM VR (DC) VDRM VD (DC) Voltage class 8 (Mark CD) 400 500 320 400 320 Unit V V V V V Rev.1.00, Mar.01.2005, page 1 of 7 CR05AS-8 Parameter RMS on-state current Average on-state current Surge on-state current I2t for fusing Peak gate power dissipation Average gate power dissipation Peak gate forward voltage Peak gate reverse voltage Peak gate forward current Junction temperature Storage temperature Mass Symbol IT (RMS) IT (AV) ITSM I2 t PGM PG (AV) VFGM VRGM IFGM Tj Tstg -- Ratings 0.79 0.5 10 0.4 0.1 0.01 6 6 0.1 - 40 to +125 - 40 to +125 50 Unit A A A A2s W W V V A C C mg Conditions Commercial frequency, sine half wave Note2 180 conduction, Ta = 57C 60Hz sine half wave 1 full cycle, peak value, non-repetitive Value corresponding to 1 cycle of half wave 60Hz, surge on-state current Typical value Notes: 1. With gate to cathode resistance RGK = 1 k. Electrical Characteristics Parameter Repetitive peak reverse current Repetitive peak off-state current On-state voltage Gate trigger voltage Gate non-trigger voltage Gate trigger current Holding current Thermal resistance Symbol IRRM IDRM VTM VGT VGD IGT IH Rth (j-a) Rated value Min. Typ. Max. -- -- 0.1 -- -- 0.1 -- -- 0.2 20 -- -- -- -- -- -- -- -- 1.9 0.8 -- 100Note3 3 70 Unit mA mA V V V A mA C/W Test conditions Tj = 125C, VRRM applied Tj = 125C, VDRM applied, RGK = 1 k Ta = 25C, ITM = 1.5 A, instantaneous value Tj = 25C, VD = 6 V, Note4 IT = 0.1 A Tj = 125C, VD = 1/2 VDRM, RGK = 1 k Tj = 25C, VD = 6 V, Note4 IT = 0.1 A Tj = 25C, VD = 12 V, RGK = 1 k Note2 Junction to ambient Notes: 2. Soldering with ceramic plate (25 mm x 25 mm x t0.7 mm). 3. If special values of IGT are required, choose item E from those listed in the table below if possible. Item B E IGT (A) 20 to 50 20 to 100 The above values do not include the current flowing through the 1 k resistance between the gate and cathode. 4. IGT, VGT measurement circuit. A1 IGS 3V DC A3 RGK 1 1k Switch IGT A2 2 V1 VGT TUT 6V DC 60 Switch 1 : IGT measurement Switch 2 : VGT measurement (Inner resistance of voltage meter is about 1k) Rev.1.00, Mar.01.2005, page 2 of 7 CR05AS-8 Performance Curves Maximum On-State Characteristics 102 7 Ta = 25C 5 3 2 101 7 5 3 2 100 7 5 3 2 10-1 0 1 2 3 4 5 10 Rated Surge On-State Current Surge On-State Current (A) 9 8 7 6 5 4 3 2 1 0 100 2 3 4 5 7 101 2 3 4 5 7 102 On-State Current (A) On-State Voltage (V) Conduction Time (Cycles at 60Hz) x 100 (%) Gate Characteristics 102 7 5 3 2 7 5 3 2 7 5 3 2 7 5 3 2 Gate Trigger Current vs. Junction Temperature 103 7 5 3 2 102 7 5 3 2 101 7 5 3 2 100 -60 -40 -20 0 20 40 60 80 100 120 140 Typical Example Gate Voltage (V) 101 VFGM = 6V PG(AV) = 0.01W VGT = 0.8V PGM = 0.1W 100 IGT = 100A (Tj = 25C) VGD = 0.2V IFGM = 0.1A 10-1 10-2 10-2 2 3 5 710-12 3 5 7 100 2 3 5 7 101 2 3 5 7 102 Gate Current (mA) Gate Trigger Current (Tj = tC) Gate Trigger Current (Tj = 25C) Junction Temperature (C) Gate Trigger Voltage vs. Junction Temperature 1.0 0.9 Maximum Transient Thermal Impedance Characteristics (Junction to ambient) 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 Distribution Typical Example Transient Thermal Impedance (C/W) Gate Trigger Voltage (V) 100 2 3 5 7 101 2 3 5 7 102 2 3 5 7 103 103 7 25x25xt0.7 5 Aluminum Board 3 2 102 7 5 3 2 101 7 5 3 2 100 10-3 2 3 5 710-2 2 3 5 710-1 2 3 5 7 100 0 -40 -20 0 20 40 60 80 100 120 140 160 Junction Temperature (C) Time (s) Rev.1.00, Mar.01.2005, page 3 of 7 CR05AS-8 Allowable Ambient Temperature vs. Average On-State Current (Single-Phase Half Wave) 160 Maximum Average Power Dissipation (Single-Phase Half Wave) 1.5 Average Power Dissipation (W) Ambient Temperature (C) = 30 60 90 120 180 1.0 25x25xt0.7 140 Aluminum Board 120 100 80 60 40 20 0 0 0.2 360 Resistive, inductive loads Natural convection 0.5 360 Resistive, inductive loads 0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 = 30 60 90 180 120 0.4 0.6 0.8 Average On-State Current (A) Average On-State Current (A) Allowable Ambient Temperature vs. Average On-State Current (Single-Phase Full Wave) 160 Maximum Average Power Dissipation (Single-Phase Full Wave) Average Power Dissipation (W) 1.5 Ambient Temperature (C) 90 = 30 60 120 180 25x25xt0.7 140 Aluminum Board 120 100 80 60 40 20 0 0 360 Resistive loads Natural convection 1.0 0.5 60 = 30 0.2 0.4 120 90 0.6 360 Resistive loads 0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 180 0.8 Average On-State Current (A) Average On-State Current (A) Allowable Ambient Temperature vs. Average On-State Current (Rectangular Wave) 160 Maximum Average Power Dissipation (Rectangular Wave) Average Power Dissipation (W) 1.5 Ambient Temperature (C) 90 180 = 30 60 120 270 DC 25x25xt0.7 140 Aluminum Board 120 100 80 60 360 1.0 Resistive, inductive loads Natural convection 0.5 360 DC 40 20 0 0 0.2 = 30 60 120 90 0.4 270 180 0.6 0.8 0 0 Resistive, inductive loads 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 Average On-State Current (A) Average On-State Current (A) Rev.1.00, Mar.01.2005, page 4 of 7 CR05AS-8 Breakover Voltage vs. Junction Temperature Breakover Voltage vs. Gate to Cathode Resistance 120 100 80 60 40 20 0 10-1 2 3 5 7100 2 3 5 7101 2 3 5 7 102 x 100 (%) 160 140 120 100 x 100 (%) Typical Example Typical Example Tj = 125C RGK = 1k 80 60 40 20 0 -40 -20 0 20 40 60 80 100 120 140 160 Breakover Voltage (RGK = rk) Breakover Voltage (RGK = 1k) Breakover Voltage (Tj = tC) Breakover Voltage (Tj = 25C) Junction Temperature (C) Gate to Cathode Resistance (k) x 100 (%) Breakover Voltage vs. Rate of Rise of Off-State Voltage 120 100 80 60 40 102 7 5 3 2 101 7 5 3 2 100 7 5 3 2 Holding Current vs. Junction Temperature Tj = 25C IH (25C) = 1mA IGT(25C) = 25A Breakover Voltage (dv/dt = vV/s) Breakover Voltage (dv/dt = 1V/s) Holding Current (mA) Distribution Typical Example #2 #1 Typical Example 20 # 1 IGT(25C = 10A) # 2 IGT(25C = 66A) Tj = 125C, RGK = 1k 0 0 2 3 5 7101 2 3 5 7 102 2 3 5 7 10 3 10 10-1 -60 -40 -20 0 20 40 60 80 100 120 140 Rate of Rise of Off-State Voltage (V/s) Junction Temperature (C) x 100 (%) 500 x 100 (%) Holding Current vs. Gate to Cathode Resistance Typical Example IGT(25C) IH(1k) 13A 1.6mA #1 59A 1.8mA #2 #1 300 #2 200 Repetitive Peak Reverse Voltage vs. Junction Temperature 160 140 120 100 80 60 40 20 0 -40 -20 0 20 40 60 80 100 120 140 160 400 100 0 10-1 2 3 5 7 100 2 3 5 7101 2 3 5 7102 Tj = 25C Repetitive Peak Reverse Voltage (Tj = tC) Repetitive Peak Reverse Voltage (Tj = 25C) Typical Example Holding Current (RGK = rk) Holding Current (RGK = 1k) Gate to Cathode Resistance (k) Junction Temperature (C) Rev.1.00, Mar.01.2005, page 5 of 7 CR05AS-8 Gate Trigger Current vs. Gate Current Pulse Width 103 7 5 4 3 2 102 7 5 4 3 2 x 100 (%) #1 #2 Typical Example IGT(25C) #1 10A #2 66A Gate Trigger Current (tw) Gate Trigger Current (DC) Tj = 25C 101 0 10 2 3 4 5 7 101 2 3 4 5 7 102 Gate Current Pulse Width (s) Rev.1.00, Mar.01.2005, page 6 of 7 CR05AS-8 Package Dimensions JEITA Package Code SC-62 RENESAS Code PLZZ0004CA-A Package Name UPAK / UPAKV MASS[Typ.] 0.050g Unit: mm 4.5 0.1 1.5 1.5 3.0 Order Code Lead form Standard packing Quantity Standard order code Standard order code example CR05AS-8-ET14 Surface-mounted type Taping 4000 Type name - ET +Direction (1 or 2) + 4 Note : Please confirm the specification about the shipping in detail. Rev.1.00, Mar.01.2005, page 7 of 7 0.8 Min 0.44 Max (0.4) 0.53 Max 0.48 Max (2.5) 1 2.5 0.1 4.25 Max 0.4 1.8 Max 1.5 0.1 0.44 Max (1.5) (0.2) Sales Strategic Planning Div. Keep safety first in your circuit designs! Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. 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Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501 Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2730-6071 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology (Shanghai) Co., Ltd. Unit2607 Ruijing Building, No.205 Maoming Road (S), Shanghai 200020, China Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952 Renesas Technology Singapore Pte. Ltd. 1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001 http://www.renesas.com (c) 2005. Renesas Technology Corp., All rights reserved. Printed in Japan. Colophon .2.0 |
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